基于圖像處理的印制電路板缺陷檢測(cè)的研究

1、華中科技大學(xué)碩士學(xué)位論文基于圖像處理的印制電路板缺陷檢測(cè)的研究姓名：段練申請(qǐng)學(xué)位級(jí)別：碩士專業(yè)：物理電子學(xué)指導(dǎo)教師：胡兵2011-01-06華 中 科 技 大 學(xué) 碩 士 學(xué) 位 論 文 華 中 科 技 大 學(xué) 碩 士 學(xué) 位 論 文 IIAbstract Printed circuit board (PCB) is the crucial component of electronic product, which provides

2、 electrical connection, the excellent quality of PCB is definitely prerequisite for stability of electronic product, therefore, PCB defect inspection is necessary to manufacture, but conventional method cannot meet the d

3、emands such as high speed, accurate estimation and low undetectability, hence automatic optical inspection (AOI) has been mainstream, which has higher speed, accuracy and less cost. The PCB automatic optical inspection h

4、as been discussed in this paper. Based on theory of image processing and machine vision, the system scheme of defect inspection is established, and algorithms required in scheme are investigated, and software structure i

5、s designed and implemented in Visual C++. Defect inspection system is composed of illumination system, image acquisition device and image processing system which includes image process and defect inspection. Defect detai

6、l of PCB will clearly appear by using a sets of algorithms such as image preprocessing, registration, segmentation and comparison, then defects also can be accurately located. After analyzing the characteristic of multip

7、le defects and three different design concept of inspection system, this paper estimates corresponding schemes against specific defects. The results of experiment show the schemes , which is contactless and meet the dema

8、nd of accuracy conventional method cannot, can detect and locate typical defect, and dimensionally measure defect involved in size. Key words: Automatic optical inspection Image processing Machine vision Defect insp